Company News

On October 22, ACCON 2026 High-end Chip Industry Innovation and Development Conference officially opened in Wuhan Optics Valley. As an industrial AI company deeply engaged in the pan-semiconductor field, Gtrontec was invited to attend the conference, delivered a keynote speech on engineering practices for AI-enabled semiconductor manufacturing, and showcased its industrial AI products and scenario-based solutions for semiconductor manufacturing at Booth A12, demonstrating its technical strength and industry accumulation in the semiconductor field.

Semiconductor manufacturing is characterized by complex processes, data intensity, and high requirements for production continuity. For AI to penetrate core mass-production links, it must not only understand the complex relationships among equipment, processes, and yield, but also work closely with existing CIM systems so that intelligent decisions truly integrate into production processes. With long-term deep engagement in high-complexity manufacturing scenarios such as wafers, packaging, and panels, Gtrontec is building differentiated technical advantages in this field.

At the “AI-Driven Semiconductor Design and Manufacturing Technology Forum,” Zhang Jian, CIM R&D Director of Gtrontec’s Semiconductor Product Department, delivered a keynote speech titled “Implementation Path of CIM AI: Engineering Practices and Challenges in Yield, Operations, and Scheduling Scenarios,” proposing an engineering approach to embedding AI inference capabilities into the CIM business system. In yield optimization, AI integrates multi-source data from MES, EAP, QMS, and other systems to carry out intelligent identification of quality anomalies, correlation analysis, and intelligent root-cause reasoning, generate process optimization suggestions, and write them back to business systems to assist engineers in decision-making; in equipment operations, based on real-time EAP data and combined with FDC fault detection and classification and PMS equipment maintenance management capabilities, AI performs anomaly warning and intelligent diagnosis, and connects diagnosis results to alarm and repair work-order systems to promote a closed loop of predictive maintenance; in production scheduling, AI comprehensively analyzes work-in-process status, equipment capacity, and transport constraints, dynamically solves optimal dispatching and transport strategies, and links with MES and AMHS for execution, enabling dynamic optimization and closed-loop feedback in production scheduling.

More valuable for industry reference, Gtrontec points the key to scaling AI implementation to data foundations, process collaboration, and engineering governance capabilities. Zhang Jian emphasized that by unifying the CIM-AI data system, establishing a tripartite joint review mechanism among algorithms, processes, and CIM implementation, and adopting manual review of key operations and anomaly rollback strategies, AI capabilities can gradually enter core production processes under the premise of ensuring mass-production stability, following a path of single-scenario pilot, single-line validation, multi-line replication, and full-factory rollout. This practice method, balancing technical advancement and engineering reliability, reflects Gtrontec’s system-level delivery capability in complex semiconductor manufacturing scenarios.

Behind the technical advantages is long-term accumulated industry practice. Gtrontec has developed full-factory CIM construction experience covering wafer manufacturing, advanced packaging and testing, and optical chips. The recently launched HYPHITECH optical chip full-factory CIM project integrates MES, EAP, RMS, SPC, YMS, AI KMS, and other systems to achieve collaboration among production, equipment, quality, materials, and industrial knowledge. The project reduced manual intervention by 80%+, shortened the production cycle by 15%+, and increased yield by 3-5 percentage points, laying a data and knowledge foundation for subsequent AI intelligent decision-making applications.

At Booth A12 of the conference, Gtrontec’s industrial AI application achievements for semiconductor manufacturing attracted many industry-chain guests to stop and exchange ideas. Around applications such as full-factory CIM, AI quality optimization, intelligent equipment, and automated logistics, on-site technical exchanges were lively, fully demonstrating market attention to the intelligent upgrading of semiconductor manufacturing.

Technical strength and market recognition corroborate each other. Recently, IDC released the “IDC MarketScape: China Industrial AI and Agent Platform 2026 Vendor Assessment,” and Getrontec successfully entered the Leaders quadrant. This authoritative market assessment provides strong evidence of Gtrontec’s comprehensive competitiveness in the industrial AI field.

The key to AI truly creating value on chip manufacturing floors lies in the depth of process understanding, the ability to collaborate with production systems, and the engineering strength to continuously create manufacturing benefits. Getrontec is combining deep semiconductor industry knowledge, mature software and automation systems, and the Octopus Brain industrial intelligent decision-making hub to continuously drive AI penetration into the core business of advanced chip manufacturing, providing more solid technical support for the intelligent upgrading of semiconductors.